Systems and methods for a smart module directly embedded on a lighting fixture

ABSTRACT

Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose directly embedded a smart module with a lighting fixture utilizing metal core PCB (MCPCB).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims a benefit of priority under 35 U.S.C. § 119 toProvisional Application No. 62/516,412 filed on Jun. 7, 2017, which isfully incorporated herein by reference in their entirety.

BACKGROUND INFORMATION Field of the Disclosure

Examples of the present disclosure are related to systems and methodsfor lighting fixtures. More particularly, embodiments disclose embeddinga smart module on a light fixture, wherein the smart module includes asensor and antenna.

Background

Lighting control systems are systems that incorporate communicationsbetween various systems inputs and outputs related for lightingcontrols. Conventionally, lighting control systems are used on bothindoor and outdoor lighting of commercial, industrial, and residentialspaces. Lighting control systems are generally used to provide the rightamount of light when and where the light is needed.

Conventional lighting control systems are employed to maximize energysavings from the lighting systems, comply with conservations programs,and produce efficient harvest of plants. Conventionally, lightingcontrol systems may operate using the temperature inside of a buildingand/or the photon levels of the lighting to implement a schedule.However, conventional systems do not allow a user to remotely receivedata associated with multiple sensor readings within a customer'spremise and/or remotely control and schedule the lighting within thecustomer premise.

Accordingly, needs exist for more effective and efficient systems andmethods for light fixtures with a smart module directly integrated intoMCPCB, wherein the MCPCB may be or may not be coupled to a heat sink.

SUMMARY

Examples of the present disclosure are related to systems and methodsfor lighting controls and sensors. Embodiments described herein mayutilize a user interface and/or embedded systems with sensors usingwireless transceivers to allow a user to set-up and control in real-timecharacteristics associated with light fixtures. In embodiments, theembedded systems may be directly embedded into metal core PCB (MCPCB)that is used as a superstructure, wherein the MCPCB may or may not becoupled with a heat sink. In embodiments, utilizing the MCPCB as asuperstructure may limit costs and the amount of wiring necessary toposition the light sources, circuitry, etc. associated with the lightfixture.

Embodiments may include a MCPCB substrate, a plurality of light emittingdiodes, and one or multiple sensor modules.

The substrate, such as a bent MCPCB sheet, may be directly populatedwith electronic components, such as LEDS, connectors, fuses, etc. TheMCPCB sheet may then be coated for protection. The bent MCPCB panel canthen be assembled into a light fixture and used with or without anadditional heat sink. Electronic components such as embedded lightsources, sensors, control circuitry may be directly embedded on theMCPCB may allow for lower material costs, lower labor costs, andsuperior thermal performance. Traces may be positioned directly on theMCPCB to connect the electronic components.

Labor costs may also be reduced by removing the steps of adhesivedispensing or tape dispensing, MCPCB placement process, and time to cureor set the adhesive or tape.

Groupings of LEDs may be positioned on MCPCB panel, which may extendalong the longitudinal axis of the MCPCB panel. The LED groupings may besymmetrically or asymmetrically spaced from the central axis of theMCPCB panel.

The sensor module may include a sensor housing, a sensor, transceiver,and circuit board that are directly embedded on the MCPCB betweengroupings of LEDs. By directly embedding the sensor module on the MCPCB,wiring associated with the superstructure can be removed, whilecondensing the positioning of electrical components of the lightfixture, which enables the electrical components to be protected via thesensor housing. Furthermore, by positioning the sensor module betweengroupings of LEDs, sensors (such as a camera) may be able to collect anddetermine data directly on an area of interest that is affected by theLEDs, wherein this direct data may be utilized to provide feedback tocontrol the LEDs.

These, and other, aspects of the invention will be better appreciatedand understood when considered in conjunction with the followingdescription and the accompanying drawings. The following description,while indicating various embodiments of the invention and numerousspecific details thereof, is given by way of illustration and not oflimitation. Many substitutions, modifications, additions orrearrangements may be made within the scope of the invention, and theinvention includes all such substitutions, modifications, additions orrearrangements.

BRIEF DESCRIPTION OF THE DRAWINGS

Non-limiting and non-exhaustive embodiments of the present invention aredescribed with reference to the following figures, wherein likereference numerals refer to like parts throughout the various viewsunless otherwise specified.

FIG. 1 depicts a light fixture system with a smart module, according toan embodiment.

FIG. 2 depicts a light fixture system with a smart module, according toan embodiment.

FIGS. 3 and 4 depict a light fixture system with a smart module,according to an embodiment.

Corresponding reference characters indicate corresponding componentsthroughout the several views of the drawings. Skilled artisans willappreciate that elements in the figures are illustrated for simplicityand clarity and have not necessarily been drawn to scale. For example,the dimensions of some of the elements in the figures may be exaggeratedrelative to other elements to help improve understanding of variousembodiments of the present disclosure. Also, common but well-understoodelements that are useful or necessary in a commercially feasibleembodiment are often not depicted in order to facilitate a lessobstructed view of these various embodiments of the present disclosure.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present embodiments. Itwill be apparent, however, to one having ordinary skill in the art thatthe specific detail need not be employed to practice the presentembodiments. In other instances, well-known materials or methods havenot been described in detail in order to avoid obscuring the presentembodiments.

FIG. 1 depicts a light fixture system 100 with a smart module 140,according to an embodiment. System 100 may include a heat sink 110,MCPCB 120, light sources 130, and smart module 140.

Heat sink 110 may be comprised of a unitary, folded sheet of metal, suchas aluminum. The sheet of metal may be folded over itself from a firstend of heat sink 110 to a second end of heat sink 110 to create fins.The fins may then be extruded to receive MCPCB 120, wherein MCPCB 120may be embedded within a body of the folded and extruded heat sink 110.In other embodiments, heat sink 110 may be formed by creating fins byextruding a unitary block of metal, such as aluminum. The extrusionsconsist of fins extending from an upper surface of the unitary block ofmetal towards or to base, wherein the extrusions may be formed byinserting the unitary block of metal through a die that include finportions. Remaining portions of the unitary block of metal may form thefins via the negative of the die. In further embodiments, the heat sink110 may be any type of heat sink with a chamber configured to receiveMCPCB 120. However, other embodiments may not include a heat sink 110.

MCPCB 120 may be formed of any metal or plastics, including: silver,tin, gold, copper, 3003 AL, 5052 AL, and/or other desired metals. Inspecific implementations, MCPCB 120 may be formed of a metal orsubstrate with a very low emissivity. However such a system would bemuch larger than a system with a high emissivity platform. Furthermore,MCPCB 120 may be formed of any material that can directly populated orembedded with the electronic components of system 100, and be affixedand embedded within a heat sink, wherein the heat sink is formed offolded fins and/or extrusions.

Light sources 130 may be light emitting diodes (LEDs) or any otherdevice that is configured to emit light. Light sources 130 may bedirectly embedded or positioned on MCPCB 120, such that additionaloperations to affix tape or thermal adhesives to MCPCB 120, a heat sink,or both are not required. Light sources 130 may be positioned from afirst end of MCPCB 110 to a second end of MCPCB 120. Light sources 130may be configured to generate heat in response to creating and emittinglight. Light sources 130 may be arranged on MCPCB 120 in a plurality ofrows, or in any predetermined layout to generate a desired light patternon an area of interest positioned below system 100. In embodiments,light sources 130 may be positioned in a plurality of sub sectionedgroupings 132, 134, which may be separated by a space 136. Inembodiments, each grouping 132, 134 of light sources 130 may be directlypositioned on MCPCB 120 to form a substructure, wherein the lightsources 130 are coupled by traces positioned on the MCPCB 120. As such,light sources 130 may utilize the electrical characteristics of MCPCB120 to form a superstructure that limits the number of electricalinterconnects of system 100.

Smart module 140 may be a device with a housing 142 and sensor 144 thatis positioned within a space 136 between groupings of light sources 130and between the bends of the MCPCB 120.

Housing 142 may be a casing that extends from a distal edge of a firstbend of MCPCB 120 to a distal edge of a second bend of MCPCB 120, andalso includes sidewalls extending to a flat surface between the bends.Housing 142 may be configured to protect the circuitry of sensor 144from the elements, environment, and heat generated from light sources130. In embodiments, housing 142 may be a plastic or metal cover.

Sensor 144 and the corresponding circuitry may be configured to bepositioned within housing 142. Sensor 144 may include a power supply,antenna, controller, and sensors, such as a CO2 sensor, temperaturesensor, humidity sensor, Photosynthetic Photon Flux sensor, radiometer,visible camera, spectrometer, fluorimeter, pyrometer, bolometer, etc. Bypositioning sensor 144 directly on MCPCB 120 between groupings of lightsources 130, sensor 144 may be able to determine data directly impactedby light sources 130. Furthermore, by utilizing the characteristics ofMCPCB 120 to form a superstructure with sensor 144, the number ofelectrical interconnects of system 100 may be reduced.

Furthermore, by positioning sensors 144 directly onto MCPCB 120 betweenlight sources 130, sensors 144 may be able to determine data associatedwith light fixture 100 directly at a point of the emitted light and/ordirectly monitor an area of interest impacted by the emitted light. Forexample, in embodiments, wherein sensors 144 include a camera, thecamera may be able to determine data, images, recordings, etc. directlyof the area of interest below the light sources 130. This may allow anoperator to remotely change characteristics of light sources 130, suchas intensity, interval duration, operating times, etc. based on theobserved area of interest.

Additional embodiments of the smart module may include a circuit boardthat is configured to be coupled to the light sources 130 and thetransceiver associated with the smart module 140. The circuit board maybe directly embedded on the MCPCB 120 as a superstructure, and may becoupled with the other elements of smart module 140 via traces that arealso directly embedded on MCPCB 120. The circuit board may be configuredto receive data from a remote computing device via the transceiver, andcommunicate data associated with the received data to control lightsources 130. For example, the circuit board may receive data from theremote computing device to dim light sources 130, modify a duty cyclesassociated with light sources 130, and locally control light sources 130based on the data.

FIG. 2 depicts a light fixture system 100 with a smart module 140,according to an embodiment. Elements depicted in FIG. 2 may be describedabove, and for the sake of brevity an additional description of theseelements is omitted.

As depicted in FIG. 2, sensor module 140 may include a plurality ofsensors 144, which may include traces that are directly positioned onMCPCB 120 to electrically connect the sensor 144. In embodiments, thetraces may be positioned within the portions of MCPCB 120 that arecovered by housing 142 to limit the amount of exposed traces, and limitthe amount of traces of system 100.

As further depicted in FIG. 2, the distal ends of the bends 122 of MCPCB120 may be positioned below the distal ends of fins 112 of the heat sink110. This positioning may be utilized to further shield the componentswithin sensor module 140 from the elements.

FIGS. 3 and 4 depict a light fixture system 300 with a smart module 140,according to an embodiment. Elements depicted in FIG. 3 may be describedabove, and for the sake of brevity an additional description of theseelements is omitted.

As depicted in FIGS. 3 and 4, a smart module 140 may be configured to bedirectly positioned on a MCPCB 120, without a heat sink 110. This maylimit the number of components that is required to have a light fixturesystem 300 with a smart module 140. Smart module 140 may be formed as asuperstructure directly embedded on MCPCB 120 with traces coupled to thelight fixture's wiring 310.

More specifically, sensors 144 associated with smart module 140 may be aBLE or other type of antenna and a COZIR sensor that are directlyembedded on the MCPCB.

Although the present technology has been described in detail for thepurpose of illustration based on what is currently considered to be themost practical and preferred implementations, it is to be understoodthat such detail is solely for that purpose and that the technology isnot limited to the disclosed implementations, but, on the contrary, isintended to cover modifications and equivalent arrangements that arewithin the spirit and scope of the appended claims. For example, it isto be understood that the present technology contemplates that, to theextent possible, one or more features of any implementation can becombined with one or more features of any other implementation.

Reference throughout this specification to “one embodiment”, “anembodiment”, “one example” or “an example” means that a particularfeature, structure or characteristic described in connection with theembodiment or example is included in at least one embodiment of thepresent invention. Thus, appearances of the phrases “in one embodiment”,“in an embodiment”, “one example” or “an example” in various placesthroughout this specification are not necessarily all referring to thesame embodiment or example. Furthermore, the particular features,structures or characteristics may be combined in any suitablecombinations and/or sub-combinations in one or more embodiments orexamples. In addition, it is appreciated that the figures providedherewith are for explanation purposes to persons ordinarily skilled inthe art and that the drawings are not necessarily drawn to scale.

The flowcharts and block diagrams in the flow diagrams illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowcharts or block diagrams may represent a module, segment, or portionof code, which comprises one or more executable instructions forimplementing the specified logical function(s). It will also be notedthat each block of the block diagrams and/or flowchart illustrations,and combinations of blocks in the block diagrams and/or flowchartillustrations, may be implemented by special purpose hardware-basedsystems that perform the specified functions or acts, or combinations ofspecial purpose hardware and computer instructions.

What is claimed is:
 1. A light fixture comprising: a substrate formed ofmetal core PCB; a first grouping of light sources embedded on thesubstrate; a second grouping of light sources embedded on the substrate,wherein there is a space between the first grouping of light sources andthe second grouping of light sources; a smart module including at leastone sensor being embedded on the substrate within the space, whereintraces associated with the smart module are directly embedded on thesubstrate, the traces being configured to electrically couple the firstgrouping of light sources, the second grouping of light sources, andelectronic components associated with the smart module.
 2. The lightfixture of claim 1, further comprising: a heat sink attached to thesubstrate, wherein the heat sink is formed of a folded fin orextrusions.
 3. The light fixture of claim 1, wherein the smart moduleincludes a camera, wherein the camera is configured to capture images ofan area of interest positioned directly under the substrate.
 4. Thelight fixture of claim 1, wherein the substrate is coupled with a heatsink.
 5. The light fixture of claim 1, wherein the smart modulesincludes at least one antenna configured to transmit data associatedwith the at least one sensor.
 6. The light fixture of claim 1, whereinthe at least one antenna is embedded within the substrate.
 7. A lightfixture comprising: a substrate formed of metal core PCB; a firstgrouping of light sources embedded on the substrate; a second groupingof light sources embedded on the substrate, wherein there is a spacebetween the first grouping of light sources and the second grouping oflight sources; a smart module including at least one sensor beingembedded on the substrate within the space, wherein the smart moduleincludes a housing configured to cover the smart module, wherein thesubstrate includes a first bend, a second bend, and a planer surfaceextending between a proximal end of the first bend and a proximal end ofthe second bend, and the housing extends from a distal end of the firstbend to a distal end of the second bend.
 8. The light fixture of claim7, wherein the housing is comprised of plastic or metal.
 9. A method offorming a light fixture comprising: embedding a first grouping of lightsources on a substrate formed of metal core PCB; embedding a secondgrouping of light sources the substrate, wherein there is a spacebetween the first grouping of light sources and the second grouping oflight sources; embedding a smart module including at least one sensor onthe substrate within the space; electrically coupling the smart modulewith the first grouping of light sources and the second grouping oflight sources via traces that are directly embedded on the substrate.10. The method of claim 9, wherein the smart module includes a housingconfigured to cover the smart module.
 11. The method of claim 10,wherein the substrate includes a first bend, a second bend, and a planersurface extending between a proximal end of the first bend and aproximal end of the second bend, and the housing extends from a distalend of the first bend to a distal end of the second bend.
 12. The methodof claim 10, wherein the housing is comprised of plastic or metal. 13.The method of claim 9, further comprising: attaching a heat sink to thesubstrate, wherein the heat sink is formed of a folded fin orextrusions.
 14. The method of claim 9, wherein the smart module includesa camera, wherein the camera is configured to capture images of an areaof interest positioned directly under the substrate.
 15. The method ofclaim 9, wherein the substrate is coupled with a heat sink.
 16. Themethod of claim 9, wherein the smart modules includes at least oneantenna configured to transmit data associated with the at least onesensor.
 17. The method of claim 9, wherein the at least one antenna isembedded within the substrate.